รายละเอียดสินค้า Honiton R260 BGA solder ball bumping station teppanyaki welding preheat oven to send help paste
Honiton R260 BGA solder ball bumping station teppanyaki welding preheat oven to send help paste
1. High-level BGA help paste 1 bottle
2. High-purity solder wire 0.8mm Volume 1
3: 1 bottle cleaner
4: cleaning brush 1
5: Cleaning cloth 1
6: BGA scraper 1
7: 3015 suction-line Volume 1
Features:
1. excellent heating material, digital temperature control and digital display table-time, stable and reliable control of humidity
2. The real-time observation of melting conditions BGA solder balls, eliminating environmental factors interfere
3. The axial fan cooling, to ensure the safety cabinet temperature
4. The alloy aluminum bottom heating, high temperature precision, small fluctuations, to eliminate damage to the BGA chip
5. At the same time welding BGA chip of different specifications
6. welding complete with sound alarm
Main Specifications:
1. The heating area: 120MM * 200MM
2. Power: 800W
3. Temperature settings: RT ~ 300 ℃ adjustable, PID temperature control.
The timing: 0.1--9.9 minutes.
5. Operating voltage: AC220V, the remaining voltage is optional.
6. Dimensions: 310MM * 280MM * 145MM (L * W * H).
7. Weight: about 7.7KG.
สินค้า By Order 15-20 วัน
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